Electronics Manufacturing

Working in high tech markets such us healthcare, avionics, railways requires to completely control the design and manufacturing processes linking every single component accepted during incoming control with the final end product Part Number and Serial Number the company is selling.

In order to make sure this process is 100% under control authomatized procedures are required. DAVE Embedded Systems, in order to accomplish with this task has completely organized its warehouse implementing a complete traceability system which grants:

• datacode management
• supplier information properly loaded in DAVE Embedded Systems'database thanks to
• Unique IDentifier code per each item
• authomatic matching system in order to link warehouse picking with the SMT process and testing process

with this system currently DAVE Embedded Systems is able, upon request, to provide customers (when required) the complete traceability of its productions in order to make sure any problem can be traced and verified since all information are tracked.

All these processes were set in DAVE EMbedded Systems because of our target is to be ready for serve custmers with high standard levels for design and manufacturing Embedded Systems. 

This is the DAVE Embedded Systems' mission: design high end embedded systems with no compromises.

DAVE Embedded Systems has a huge experience in coating and sealing of embedded systems for many applications. Railways, transportation and military/avionics are the main areas where these features are required but also many industrial products requires to protect the electronics boards against:

• dust
• short circuits
• thin wiskers (etc.)

DAVE Embedded Systems has developed its own internal quality procedures in according with the standards MIL 610 and 610D. In the following are described the main working phases with some hints about our internal quality procedure:

Working Phase

1. Cleaning with co-solvent product (Washing)
2. Sealing
3. Masking area must be clear by coat
4. Coating

Washing

Before apply any sealing or coating it is important to clean the board even if a noclean paste is used. Typically we adopt a Co-solvent product like TOPKLEAN EL20-R. A

Sealing

The main scope of Sealing is to preserve BGA by DUST or DIRTY that can cause failure on the field. Sealing product must be easily removed in case of service repair, since a peel mask product must be used. We adopt typically approved sealing material for military applications likeDYMAX 9-20318-F which requires UV Curing. With this material a good result is assured in automatic process with great repeatibility. In particular bubbles and void are easily solved with this kind of process and material.

Potting

Resin compounds are nowadays used for many different purposes and their application fields are increasing every day.

Potting and encapsulation is the process of embedding electronic components and assemblies in a liquid resin (potting compounds) to protect them against rough environment conditions. Potting can be performed in atmosphere pressure or even under vacuum, if high voltage insulation and high temperature differences are needed. Encapsulation of parts will stop corrosion of metals and reduce damage caused by vibration and mechanical stress.

It is possible handle 1- and 2-component polyurethanes, epoxies, acrylics, silicones - temperature, humidity and UV curing materials. They can be from low- to high-viscosity, filled or unfilled and even high abrasive for thermal conductivity.

Within this process it is possible to protect sensibles circuitry against water, vibrations, etc... DAVE Embedded Systems and its partners it is able to perform this phase with the most modern equipments in order to satisfy the customers in any business environment.