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AMD Zynq Ultrascale+ - ONDA SOM

NEW at EW2026! Evaluation Kits available MAY 2026

Processor Xilinx Zynq® UltraScale+™ MPSoC

In the new era of Internet Of Things, customers are requiring to add connectivity and new functionalities on their products. Customers are also keen to product longevity and hardware/software maintenance. For these reasons DAVE Embedded Systems has designed a new solution based on Xilinx Zynq® UltraScale+™ MPSoC devices that is compatible with the existing BORA System On Module based on Xilinx Zynq® MPSoC.

Dual- and quad-core application processor equipped devices deliver maximum scalability, and are capable of offloading critical applications, such as graphics and video pipelining, to dedicated processing blocks, along with a full complement of integrated peripherals and connectivity cores suitable for next-generation systems. For the most compute intensive processing tasks, integrated programmable logic offers up to 1 00X performance improvement over processor-based implementations. With this design, DAVE Embedded Systems provides its customers with a platform that benefits of the latest Xilinx technology together with the compatibility with the existing SoM product line. Business continuity and product maintenance are the key words around this product including high reliability options like conformal coating, sealing and lead process manufacturing for avionic and defense applications.

Main Features

  • Up to 4 ARM® Cortex™- A53 Processor
  • Two ARM Cortex™- R5 Real-time Processors
  • ARM Mali™- 400 Graphic Processing Unit
  • Platform Management Unit for Power and Safety Management
  • Config and Security Unit
  • Programmable Logic with High Speed Transceivers
  • H264 / H265 video codec
  • DDR4 memory on board up to 64bits bandwidth
  • Pinout matching with BORA product line
  • Designed for industrial environment
  • CG/EG/EV support from ZU2 to ZU5 families

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Datasheet

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Technical Information

CPU
  • AMD Zynq™ UltraScale+™ MPSoC CG/EG/EV Device with:
    • Quad-core Arm Cortex-A53 MPCore™ up to 1.5 GHz
    • Dual-core Arm Cortex-R5F MPCore up to 600 MHz
    • Supported up to XCZU5CG, XCZU5CGEG and XCUZU5EV
Supervisor
  • On-board power supply supervision
Memory
  • SDRAM: Up to 8GB LPDDR4 with HW ECC
  • NOR: Bootable QSPI NOR 8, 16 MB
  • eMMC: up to 128GB pSLC
Interfaces
  • Up to 2xUSB 3.0
  • Up to 2xPCIe Gen2
  • LAN: Ethernet 10/100/1000 Mbps 
  • 3x Additional RGMII interface
  • UART: up to 2x UART ports
  • USB: up to 2x 2.0 OTG port 
  • CAN: up to 2x CAN
  • Debug:
    • JTAG IEEE 1149.1 Test Access Port
    • CoreSight™ and Program Trace Macrocell (PTM)
  • Other:
    • 2 x SD/SDIO 2.0/MMC 3.31
    • up to 2 x I²C channels
    • up to 2 x SPI channels
    • up to 328 GPIOs available
FPGA
  • Logic Cells: up to 256K
  • LUTs:  up to 117K
  • Flip Flops: up to 234K
  • Total RAM: 26.6Mb
  • DSP Slices: 1248
  • 4x 6Gb/s tranceivers
Mechanical
  • Connectors: 3 x 140 pin 0.6mm pitch
  • Size: 80mm x 50mm
  • Temperature range:
    • Commercial (0°C / +70°C) temperature range
    • Industrial (-40°C / +85°C) temperature range
    • Defense grade (-40°C / +125°C) temperature range
Power Supply
  • Input: 3.3V, on-board voltage regulation
Software
  • Bootloader: U-Boot
  • Multitasking: Linux Yocto, Petalinux
  • Support for Long term BSP maintenance (See ToloMEO services)

 

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